Each pack contains three Si HJT wafers without ITO layers on either side (Note: p and n sides are indicated in the packaging box, the pyramid size ranges from 1~1.5µm) + one set (two pieces) of identical masks (see above picture for diagram) made from glass fiber (a material adoptable to UHV sputtering chamber) for patterned ITO coating on both sides and for patterned metal coating on the p side. The Si wafer size =210mm x 105 mm. Customers can coat ITO on both sides with desired thickness, and use laser to cut the wafer into smaller pieces.